Initial release: ESP32-C3 CO2 & environment sensor board

KiCad 10 design (schematic, 2-layer layout, custom symbols and footprints),
fabrication data for PCBWay (Gerber X2, Excellon, job file), BOM, generated
documentation (schematic PDF, layer plots, 3D render) and firmware notes.

gerber/esp+sensair-job.gbrjob

@@ -0,0 +1,147 @@
+{
+  "Header": {
+    "GenerationSoftware": {
+      "Vendor": "KiCad",
+      "Application": "Pcbnew",
+      "Version": "10.0.6"
+    },
+    "CreationDate": "2026-09-08T00:42:25+02:00"
+  },
+  "GeneralSpecs": {
+    "ProjectId": {
+      "Name": "esp+sensair",
+      "GUID": "6573702b-7365-46e7-9361-69722e6b6963",
+      "Revision": "rev?"
+    },
+    "Size": {
+      "X": 50.05,
+      "Y": 40.05
+    },
+    "LayerNumber": 4,
+    "BoardThickness": 1.6002,
+    "Finish": "None"
+  },
+  "DesignRules": [
+    {
+      "Layers": "Outer",
+      "PadToPad": 0.15,
+      "PadToTrack": 0.15,
+      "TrackToTrack": 0.15,
+      "MinLineWidth": 0.4,
+      "TrackToRegion": 0.5,
+      "RegionToRegion": 0.5
+    },
+    {
+      "Layers": "Inner",
+      "PadToPad": 0.15,
+      "PadToTrack": 0.15,
+      "TrackToTrack": 0.15
+    }
+  ],
+  "FilesAttributes": [
+    {
+      "Path": "esp+sensair-Front.gbr",
+      "FileFunction": "Copper,L1,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "esp+sensair-Back.gbr",
+      "FileFunction": "Copper,L4,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "esp+sensair-F_Silkscreen.gbr",
+      "FileFunction": "Legend,Top",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "esp+sensair-B_Silkscreen.gbr",
+      "FileFunction": "Legend,Bot",
+      "FilePolarity": "Positive"
+    },
+    {
+      "Path": "esp+sensair-F_Mask.gbr",
+      "FileFunction": "SolderMask,Top",
+      "FilePolarity": "Negative"
+    },
+    {
+      "Path": "esp+sensair-B_Mask.gbr",
+      "FileFunction": "SolderMask,Bot",
+      "FilePolarity": "Negative"
+    },
+    {
+      "Path": "esp+sensair-Edge_Cuts.gbr",
+      "FileFunction": "Profile",
+      "FilePolarity": "Positive"
+    }
+  ],
+  "MaterialStackup": [
+    {
+      "Type": "Legend",
+      "Name": "Top Silk Screen"
+    },
+    {
+      "Type": "SolderPaste",
+      "Name": "Top Solder Paste"
+    },
+    {
+      "Type": "SolderMask",
+      "Thickness": 0.01,
+      "Name": "Top Solder Mask"
+    },
+    {
+      "Type": "Copper",
+      "Thickness": 0.035,
+      "Name": "Front"
+    },
+    {
+      "Type": "Dielectric",
+      "Thickness": 0.4801,
+      "Material": "FR4",
+      "Name": "Front/In1.Cu",
+      "Notes": "Type: dielectric layer 1 (from Front to In1.Cu)"
+    },
+    {
+      "Type": "Copper",
+      "Thickness": 0.035,
+      "Name": "In1.Cu"
+    },
+    {
+      "Type": "Dielectric",
+      "Thickness": 0.4801,
+      "Material": "FR4",
+      "Name": "In1.Cu/In2.Cu",
+      "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
+    },
+    {
+      "Type": "Copper",
+      "Thickness": 0.035,
+      "Name": "In2.Cu"
+    },
+    {
+      "Type": "Dielectric",
+      "Thickness": 0.4801,
+      "Material": "FR4",
+      "Name": "In2.Cu/Back",
+      "Notes": "Type: dielectric layer 3 (from In2.Cu to Back)"
+    },
+    {
+      "Type": "Copper",
+      "Thickness": 0.035,
+      "Name": "Back"
+    },
+    {
+      "Type": "SolderMask",
+      "Thickness": 0.01,
+      "Name": "Bottom Solder Mask"
+    },
+    {
+      "Type": "SolderPaste",
+      "Name": "Bottom Solder Paste"
+    },
+    {
+      "Type": "Legend",
+      "Name": "Bottom Silk Screen"
+    }
+  ]
+}