{
  "Header": {
    "GenerationSoftware": {
      "Vendor": "KiCad",
      "Application": "Pcbnew",
      "Version": "10.0.6"
    },
    "CreationDate": "2026-09-08T00:42:25+02:00"
  },
  "GeneralSpecs": {
    "ProjectId": {
      "Name": "esp+sensair",
      "GUID": "6573702b-7365-46e7-9361-69722e6b6963",
      "Revision": "rev?"
    },
    "Size": {
      "X": 50.05,
      "Y": 40.05
    },
    "LayerNumber": 4,
    "BoardThickness": 1.6002,
    "Finish": "None"
  },
  "DesignRules": [
    {
      "Layers": "Outer",
      "PadToPad": 0.15,
      "PadToTrack": 0.15,
      "TrackToTrack": 0.15,
      "MinLineWidth": 0.4,
      "TrackToRegion": 0.5,
      "RegionToRegion": 0.5
    },
    {
      "Layers": "Inner",
      "PadToPad": 0.15,
      "PadToTrack": 0.15,
      "TrackToTrack": 0.15
    }
  ],
  "FilesAttributes": [
    {
      "Path": "esp+sensair-Front.gbr",
      "FileFunction": "Copper,L1,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "esp+sensair-Back.gbr",
      "FileFunction": "Copper,L4,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "esp+sensair-F_Silkscreen.gbr",
      "FileFunction": "Legend,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "esp+sensair-B_Silkscreen.gbr",
      "FileFunction": "Legend,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "esp+sensair-F_Mask.gbr",
      "FileFunction": "SolderMask,Top",
      "FilePolarity": "Negative"
    },
    {
      "Path": "esp+sensair-B_Mask.gbr",
      "FileFunction": "SolderMask,Bot",
      "FilePolarity": "Negative"
    },
    {
      "Path": "esp+sensair-Edge_Cuts.gbr",
      "FileFunction": "Profile",
      "FilePolarity": "Positive"
    }
  ],
  "MaterialStackup": [
    {
      "Type": "Legend",
      "Name": "Top Silk Screen"
    },
    {
      "Type": "SolderPaste",
      "Name": "Top Solder Paste"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Name": "Top Solder Mask"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "Front"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.4801,
      "Material": "FR4",
      "Name": "Front/In1.Cu",
      "Notes": "Type: dielectric layer 1 (from Front to In1.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "In1.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.4801,
      "Material": "FR4",
      "Name": "In1.Cu/In2.Cu",
      "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "In2.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.4801,
      "Material": "FR4",
      "Name": "In2.Cu/Back",
      "Notes": "Type: dielectric layer 3 (from In2.Cu to Back)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "Back"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Name": "Bottom Solder Mask"
    },
    {
      "Type": "SolderPaste",
      "Name": "Bottom Solder Paste"
    },
    {
      "Type": "Legend",
      "Name": "Bottom Silk Screen"
    }
  ]
}