Hannes
504e4e1454
- Rename KiCad project/schematic/board (and local .prl) to drop the '+', updating all internal cross-references (project name, sheetfile, title blocks) - Remove the '+' from Gerber/drill/job filenames and the job file's internal Name/Path references; rebuild the upload zip with clean names - Stop tracking gerber/ (derived artifacts): untrack, gitignore, and publish the fabrication zip as a GitHub Release asset instead - README/CHANGELOG: point fabrication data at the release, mark the '+' naming issue as fixed, refresh the repository layout
38 lines
1.9 KiB
Markdown
38 lines
1.9 KiB
Markdown
# Changelog
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All notable changes to this project are documented here.
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The format follows [Keep a Changelog](https://keepachangelog.com/en/1.1.0/).
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## [1.0.0] - 2026-10-19
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First public release of the ESP32-C3 CO₂ & environment sensor board (prototype v1).
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### Added
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- **Hardware design** (KiCad 10): schematic, 2-layer board layout, custom symbol
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library (`esp_sensair_stuff.kicad_sym`) and footprint library
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(`esp_sensair_stuff.pretty/`) for the ESP32-C3 module, Sensirion S8 and BME280.
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- Project-local library tables (`fp-lib-table`, `sym-lib-table`) so the design
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opens with all custom parts resolved on a fresh clone.
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- **Fabrication data**: Gerber X2 plot, Excellon PTH/NPTH drills, Gerber
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job/stackup file, packaged as a ready-to-upload `esp-sensair.zip`. These are
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derived artifacts published as GitHub Release assets (not committed to the tree).
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- **Bill of materials** (`bom/esp-sensair-bom.csv`) plus the human-readable BOM
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in the README.
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- **Documentation** in `docs/`: schematic PDF, top/bottom layer plots, 3D render.
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- **Firmware** (`firmware/`): ESPHome configuration and secrets templates
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(`*.example`) for the ESP32-C3 (esp-idf), BME280 over I²C and Sensirion S8
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over UART, with Home Assistant API (noise encryption) and OTA.
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- **Licensing**: CERN-OHL-S-2.0 for hardware (`LICENSE`), MIT for firmware, BOM
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and docs (`LICENSE.MIT`).
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- `.gitignore` covering KiCad local history/backups/lock files, ESPHome build
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artifacts, live firmware credentials, and OS/editor noise.
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### Known issues
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See the "Known issues and lessons learned (v1 → v2)" section of the
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[README](README.md). Highlights: power delivered through the module's USB-C 5 V
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path, single decoupling capacitor, no mounting holes, no populated I²C pull-ups,
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unannotated schematic, and leaded HASL. (The `+` that was in the project name has
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been removed; the project and fabrication files are now `esp-sensair`.)
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